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- ARM926EJ-S @ 266 MHz
- Not recommended for new designs
The LPC3250 OEM board is suitable for applications that require high performance, high integration, and low power consumption.
Compact form factor, 68×48 mm, using the proven SODIMM connector.
NXP Technology
The LPC3250 has a ARM926EJ-S core and was designed for low power, high performance applications.
Temperature Range
The LPC3250 OEM board is available in commercial temperature range, 0 to +70 degrees Celsius.
| CPU Details | |
|---|---|
| CPU | ARM926EJ-S @ 266 MHz |
| RAM | 256 KByte internal, 64 MByte SDRAM |
| Flash | 4 MByte NOR Flash, 128 MByte NAND flash |
| Multimedia | |
|---|---|
| Graphics Output | Parallel RGB |
| Hardware 2D/3D Graphic | No |
| Hardware Video | SW only |
| Graphics input | No |
| Audio | I2S |
| Connectivity | |
|---|---|
| Ethernet | 10/100 Mbps |
| USB | 1x FS USB 2.0 OTG |
| Wi-Fi | No |
| FlexIO | No |
| Serial | 2x SPI, 7x UART, 2x I2C |
| ADC / PWM | 3 ch (10-bit) / 2 ch |
| SD | MCI |
| PCIe | - |
| Serial ATA | - |
| Physical | |
|---|---|
| Temperature | 0 to 70°C |
| Size | 68 x 48 mm |
| Connector | 200 pos SODIMM |
| Product Classification and Status | |
|---|---|
| Integration board; End-of-Life | |
| Documentation and guides | |
|---|---|
| OEM Board Integration Guide | |
| Product notes / changes | |
|---|---|
| NAND change and Measurements (2014-12-20) | |
| Conformity | |
|---|---|
| Product compliance declarations | |
